SANTA CLARA, Calif., Feb. 28, 2017 (GLOBE NEWSWIRE) — Adesto Technologies (NASDAQ:IOTS), a leading provider of application-specific, ultra-low power non-volatile memory (NVM) products, announced that its DataFlash memory device helps enable the intelligent operation of the Ozobot Evo, a new smart robot toy that connects learners and creators to explore, collaborate and share.
Continue reading Adesto’s DataFlash® Memory Enables Smart Features and Longer Battery-Life in the Ozobot® Evo, the Connected Social Robot
ALHAMBRA, Calif., Feb. 28, 2017 (GLOBE NEWSWIRE) — EMCORE Corporation (NASDAQ:EMKR), a leading provider of advanced Mixed-Signal Optics products that provide the foundation for today’s high-speed communication network infrastructures and leading-edge defense systems, announced today the introduction of the 5200 Series, 3 and 6.5 GHz Fiber Optic Links for satellite communications and wireless applications. The 5200 series are a compact, weatherproof fiber optic transmitter and receiver pair for Inter-Facility Link (IFL) applications where high-performance under demanding conditions is critical. EMCORE will debut its new 5200 series fiber optic links at Satellite 2017, booth #1736, March 7-9 at the Walter E. Washington Convention Center, Washington, DC.
Continue reading EMCORE Introduces 5200 Series 3 and 6.5 GHz Fiber Optic Links for Satellite Communications and Wireless Applications
TAINAN, Taiwan, Feb. 28, 2017 (GLOBE NEWSWIRE) — Himax Technologies, Inc. (Nasdaq:HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced the Company will attend the 29th Annual ROTH Conference in Dana Point, CA on March 14-15, 2017 at the Ritz Carlton, Laguna Niguel, in Dana Point, CA. Continue reading Himax Technologies, Inc. to Attend 29th Annual ROTH Conference in Dana Point, CA on March 14-15, 2017
TOKYO, Feb. 28, 2017 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE:6857) has introduced the new HF-AWGD (high-frequency arbitrary waveform generator and digitizer) module to extend the capabilities of its EVA100 measurement platform to include high-resolution and high-speed analog devices. With the new module, the EVA100 system can measure all key parameters of mixed-signal, precision and standard analog semiconductors used in high-growth applications including on-board automotive electronics.
Continue reading Advantest Launches New Module, Extending EVA100 Measurement System’s Capabilities for High-Resolution, High-Speed ICs
BARCELONA, Spain, Feb. 28, 2017 (GLOBE NEWSWIRE) — Semtech Corporation (Nasdaq:SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced technology advancements to its LinkCharge™ wireless charging platform for concurrently charging multiple, low-power devices using a single transmitter. The technology is being used in its next-generation of wireless chargers, LinkCharge LP (low power). Continue reading Semtech Debuts LinkCharge™ Wireless Charging Technology for Multiple Devices at Mobile World Congress
BARCELONA, Spain, Feb. 28, 2017 (GLOBE NEWSWIRE) — DSP Group®, Inc. (NASDAQ:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today that Internet of Things (IoT) frontrunner LEEDARSON has selected DSP Group’s DHAN-S module for battery-operated and AC-powered IoT products. This turnkey platform will be integrated into LEEDARSON lighting solutions, security and intelligent lighting controls and sensing and communication systems. Specializing in smart, energy-saving technologies, LEEDARSON required a SoC solution that could provide high-quality computational power while still operating efficiently in a low-energy mode. By embedding DSP Group’s ULE technology for smart devices and home area network (HAN) applications, LEEDARSON will be able to unlock new opportunities where low cost, long-battery lifetime and interference-free, long-range coverage is desired.
Continue reading DSP Group’s ULE to Drive Low Power Connectivity in LEEDARSON Smart Products
Mobile World Congress, Barcelona, February 28, 2017 – Gemalto (Euronext NL0000400653 GTO), the world leader in digital security, is introducing a rapid prototyping tool that will speed and simplify the creation of new Internet of Things (IoT) applications. The Cinterion® Connect Shield development board utilizes the popular and highly accessible Arduino¹ design environment, and features an intelligent modem chipset optimized for low power IoT devices that can deliver extended battery life. Continue reading Gemalto accelerate IoT innovation with new rapid prototyping tool
CHELMSFORD, Mass., Feb. 27, 2017 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ:MRCY) (www.mrcy.com), announced it received a 2016 Enterprise Supplier Recognition Award from Northrop Grumman. Presented at a ceremony during Northrop Grumman’s recent Global Partner Forum, the award recognizes Mercury for competitive advantage and enterprise-level supply chain excellence that add value to Northrop’s programs. Continue reading Mercury Systems Receives 2016 Enterprise Supplier Recognition Award from Northrop Grumman
SARASOTA, Fla., Feb. 27, 2017 (GLOBE NEWSWIRE) — Sun Hydraulics Corporation (NASDAQ:SNHY) (“Sun” or the “Company”), a global industrial technology leader that develops and manufactures solutions for both the hydraulics and electronics markets, today reported financial results for the fourth quarter and full year 2016. The results include Enovation Controls since its acquisition on December 5, 2016. Additionally, the Board of Directors authorized a $1.3 million shared distribution.
Continue reading Sun Hydraulics Reports Fourth Quarter 2016 Results and Announces Shared Distribution