Water Testing and Analysis Market Steps Into Save Us From Unsafe Waters – IndustryARC

Hyderabad, India, March 28, 2017 (GLOBE NEWSWIRE) — The report “Water Testing and Analysis Market: Test (TOC, PH, Conductivity, Dissolved Oxygen, Turbidity, Others) Product (Portable, Benchtop, Hand-held, Others) End-User (Environmental, Industrial, Laboratories, Others) By Application & By Geography-Forecast (2016-2022)”, published by IndustryARC, estimates that stringent government regulations and water scarcity will keep the market in Americas, notably, U.S., Mexico and Canada, growing. Continue reading Water Testing and Analysis Market Steps Into Save Us From Unsafe Waters – IndustryARC

STMicroelectronics’ Chips Stand Guard in Haltian’s Trackerphone for Children and Seniors

Geneva, March 28, 2017 — Motion-sensing and data-processing chips from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, help increase family safety in the Snowfox trackerphone, a two-way portable communication device with locating capabilities designed for children and seniors by Haltian, a Finnish design and engineering start-up. Continue reading STMicroelectronics’ Chips Stand Guard in Haltian’s Trackerphone for Children and Seniors

Temperature Sensors Market To Show Slight Rise With Multiple Industry Applications – IndustryARC Research

Hyderabad, India, March 28, 2017 (GLOBE NEWSWIRE) — The report “Temperature Sensors Market: By Product Type (Thermistor, RTD, Thermocouple, ICs, Thermopiles, IR Sensors); Industry Verticals (Petrochemicals, Manufacturing, Automation, Electronics, Automotive) – Forecast (2017 – 2022)”, published by IndustryARC, estimates that with technological advancements, need for consumer electronics and demand of medical sensors, the market will accelerate notably in North America followed by Europe. Continue reading Temperature Sensors Market To Show Slight Rise With Multiple Industry Applications – IndustryARC Research

Politics to Affect Shape of U.S. Defense Electronics Market

NEWTOWN, Conn., March 28, 2017 (GLOBE NEWSWIRE) — America experienced a dramatic shift in its political landscape on November 8, 2016 with the election of businessman Donald Trump as President of the United States. Furthermore, the Republican Party secured a monopoly on power in Washington, keeping control of the Senate and gaining a majority in the House of Representatives. "All of this will play a serious role in shaping the U.S. defense budget and with it the overall defense market," said Richard Sterk, Senior Analyst and editor of Forecast International’s “The Market for U.S. Defense Electronics.” Continue reading Politics to Affect Shape of U.S. Defense Electronics Market

NXP Expands IoT Leadership with Real-time NFC Authentication and Sensing Across Secure Healthcare and Retail

EINDHOVEN, Netherlands, March 28, 2017 (GLOBE NEWSWIRE) — As a leading innovator of NFC solutions, NXP Semiconductors N.V. (NASDAQ:NXPI) today unveiled new solutions to capitalize on the inherent security and interactive capabilities of NFC for advanced product authentication, integrity assurance and enhanced user engagement across consumer manufactured goods, healthcare, retail and other industries.
Continue reading NXP Expands IoT Leadership with Real-time NFC Authentication and Sensing Across Secure Healthcare and Retail

TowerJazz and TPSCo Release Enhanced up to 200V 180nm BCD on SOI Power Management Process

TowerJazz, the global specialty foundry leader, and TowerJazz Panasonic Semiconductor Co., Ltd. (TPSCo), the leading analog foundry in Japan, announced today the availability of a newly developed, state of the art 180nm Bipolar-CMOS-DMOS (BCD) SOI power management technology platform supporting applications with up to 200V breakdown voltage. The process features an integrated Deep Trench isolation and buried Oxide which provide superior performance for a wide range of analog and power applications such as motor drivers, home and industrial appliances, battery management systems, electric vehicles, ultra-fast GaN drivers, industrial motor controllers, and many more. Continue reading TowerJazz and TPSCo Release Enhanced up to 200V 180nm BCD on SOI Power Management Process

Complete Overview mCube’s MC3672: The Smallest WLCSP MEMS Accelerometer for Wearables

Dublin, March 24, 2017 (GLOBE NEWSWIRE) — Research and Markets has announced the addition of the "mCube MC3672: The smallest WLCSP MEMS Accelerometer for Wearables" report to their offering.
With the MC3672, mCube has released the industry's smallest WLCSP ultra-low power accelerometer for wearables, enabling significantly extended battery life and very small form factors. This new component should increase the company's market share. One target is earbud applications, like Apple's AirPods, where power consumption is a major parameter and the space is very limited.
Unlike its main competitors, Bosch Sensortec and STMicroelectronics, mCube provides monolithic sensor integration for consumer electronics in a WLCSP package. This uses only wafer level steps to assemble the ASIC, MEMS sensor, MEMS cap and package. Mainly produced by TSMC, which made great efforts to provide complete platforms for MEMS manufacturing, the component is elegantly designed and better integrated than most of its competitors.
After Bosch Sensortec released a WLCSP 3-axis accelerometer, mCube chose a different approach, although it still uses a Via-Middle TSV process for the package integration. Two TSV processes are used in this component, including for connecting the MEMS sensor to the IC electronics.
The final size is smaller compared than Bosch's device, at 1.1mmx1.3mmx0.74mm. This is a 45% footprint and 21% thickness reduction compared to the previous 1.6mmx1.6mmx0.94mm mCube MC3635 LGA package and a 64% footprint reduction compared to the present 2mmx2mm LGA package.
The report includes a complete overview of the evolution of mCube's MEMS accelerometers since the second generation. It also features a detailed technology and cost comparison with leading edge accelerometers from Bosch Sensortec and STMicroelectronics and a process comparison with Bosch's WLCSP accelerometer.
Key Topics Covered:
Overview / Introduction
Company Profile and Supply Chain
Physical Analysis
Package
– Package views, dimensions and pin-out
– Package cross-section
– Package opening
– MEMS Cap
– MEMS Sensing Area
– View, dimensions, and marking
– Delayering and process
– ASIC Die
– View, dimensions, and marking
– Delayering and process
– Cross-section
Physical Comparison
mCube accelerometer evolution
– Comparison with competitors
– Package comparison with Bosch BMA355
Manufacturing Process Flow
ASIC front-end process
– ASIC wafer fabrication unit
– MEMS process flow
– MEMS wafer fabrication unit
– Packaging process flow
– Package assembly unit
Cost Analysis
Synthesis of the cost analysis
– Yield explanation and hypotheses
– ASIC front-end cost
– MEMS front-end cost
– MEMS front-end cost per process steps
– Total front-end
– WLCSP package cost
– WLCSP package per process steps
– Component cost
Estimated Price Analysis
Companies Mentioned
– Bosch
– STMicroelectronics
For more information about this report visit http://www.researchandmarkets.com/research/pj6pkl/mcube_mc3672_the Continue reading Complete Overview mCube’s MC3672: The Smallest WLCSP MEMS Accelerometer for Wearables

The “Brain” of the Space Launch System RS-25 Engine Passes Critical Test

STENNIS SPACE CENTER, Miss., March 23, 2017 (GLOBE NEWSWIRE) — An RS-25 rocket engine with a new flight-model engine controller and flight configuration software was successfully tested for the first time at NASA’s Stennis Space Center earlier today. Four RS-25 engines, manufactured by Aerojet Rocketdyne, a subsidiary of Aerojet Rocketdyne Holdings, Inc. (NYSE:AJRD), will help propel NASA’s Space Launch System (SLS) rocket, America’s next generation heavy-lift launch vehicle, and the controller unit is a key component for the rocket’s safety and reliability.
Continue reading The “Brain” of the Space Launch System RS-25 Engine Passes Critical Test

Cardiovascular Monitoring Devices Market Expects Major Telecom Players To Power Remote Monitoring Devices Of The Future – MarketIntelReports

Wilmington, Delaware, United States, March 23, 2017 (GLOBE NEWSWIRE) — The report “Cardiovascular Monitoring Devices- Medical Devices Pipeline Assessment”, available on MarketIntelReports, estimates that countries like India will be key future growth drivers Continue reading Cardiovascular Monitoring Devices Market Expects Major Telecom Players To Power Remote Monitoring Devices Of The Future – MarketIntelReports

TowerJazz Announces New Foundry Silicon Photonic (SiPho) Process Targeting Optical Transceiver Electronics Market

TowerJazz, the global specialty foundry leader, announced today a new silicon photonic process (SiPho) which complements its SiGe BiCMOS processes utilized for the manufacture of optical transceiver electronics. Further, TowerJazz is collaborating with PhoeniX Software to provide process design kits (PDKs) for its customers who are developing optical networking and data center interconnects applications. Silicon photonics holds the potential to become a cost-effective, scalable technology for the production of photonic integrated circuits and addresses the high-performance requirements of these applications.
Continue reading TowerJazz Announces New Foundry Silicon Photonic (SiPho) Process Targeting Optical Transceiver Electronics Market