Himax Technologies, Inc. to Attend Credit Suisse 21st Annual Technology, Media & Telecom Conference on November 27th – 30th, 2017

TAINAN, Taiwan, Nov. 13, 2017 (GLOBE NEWSWIRE) — Himax Technologies, Inc. (Nasdaq:HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced that the Company will attend Credit Suisse’s 21st Annual Technology, Media & Telecom Conference on November 27th – 30th, 2017 at The Phoenician in Scottsdale, Arizona. Continue reading Himax Technologies, Inc. to Attend Credit Suisse 21st Annual Technology, Media & Telecom Conference on November 27th – 30th, 2017

Lubrizol Joins HP’s Open Materials and Applications Platform to Advance Estane® Engineered Polymers in 3DP Applications

CLEVELAND, November 10, 2017 – The Lubrizol Corporation announces today its collaboration with HP as a partner in their Open Materials and Applications Platform to accelerate the development and adoption of its Estane® Engineered Polymers in 3D Printing (3DP) for demanding applications requiring elastomeric properties and strength. 3DP is an exciting technology that has advanced the development of printable thermoplastics materials and their use in rapid prototyping, molds and supports, and small scale final part production. Despite this, innovation is needed to enable full scale industrial production, solidifying the importance of the relationship between Lubrizol and HP. Continue reading Lubrizol Joins HP’s Open Materials and Applications Platform to Advance Estane® Engineered Polymers in 3DP Applications

Microcontrollers Performing High Standards in automobiles industry, to Witness a CAGR of 17.2% during 2017 – 2023

NEW YORK, Nov. 10, 2017 (GLOBE NEWSWIRE) — The market is expected to witness a CAGR of 17.2%, and is projected to reach USD 2,636.9 Million by 2023. Factors propelling the growth of automotive microcontroller market include increase in technological advancement, increased in production of electric vehicles, installation of enhanced safety features and practices saving power & space and to bring down fuel consumption.
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Vesper Named CES 2018 Innovation Awards Honoree for ZeroPower Listening MEMS Microphone

BOSTON, Nov. 09, 2017 (GLOBE NEWSWIRE) — Vesper, developer of the world’s most advanced acoustic sensors, today picked up a major industry recognition: the Consumer Technology Association (CTA)™ named Vesper a CES 2018 Innovation Awards Honoree for the VM1010 — its patented ZeroPower Listening™ MEMS microphone — during an awards ceremony held on November 9, 2017 at CES Unveiled New York. The VM1010 will be displayed at CES 2018, which runs January 9-12, 2018 in Las Vegas, Nevada.
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AMD Ryzen™ Threadripper™ 1950X Wins CES 2018 Best of Innovation Award

SUNNYVALE, Calif., Nov. 09, 2017 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ:AMD) announced that its high-performance, enthusiast Ryzen™ Threadripper™ 1950X processor is the CES 2018 Best of Innovation Award winner in the Computer Hardware and Components category. Products entered in this prestigious program are judged by a panel of independent industrial designers, engineers, and members of the trade media to honor outstanding design and engineering in cutting-edge consumer electronics across 28 categories.
Continue reading AMD Ryzen™ Threadripper™ 1950X Wins CES 2018 Best of Innovation Award

Mercury Systems Ships Defense Industry’s First BuiltSecure DDR4 High Density Secure Memory Device

ANDOVER, Mass., Nov. 09, 2017 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ:MRCY) (www.mrcy.com) announced that it has shipped the defense industry’s first BuiltSecure™ high density secure memory devices manufactured with double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM). The Company’s first BuiltSecure DDR4 product embeds 8GB of high-speed DDR4 memory in an ultra-compact 13 by 20 millimeter ball grid array (BGA) package optimized for reliability in harsh military environments. A leading supplier of defense microelectronics is currently integrating Mercury’s DDR4 devices into a next-generation computing system for a military avionics command, control and intelligence application.
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Advanced Wireless-Charging Chip from STMicroelectronics Enables Faster Charging of Smartphones and Tablets

  • New charging controller supports the latest industry standard (Qi Extended Power) for faster charging of smartphones and tablets
  • Patented detection and safety features, with best-in-class standby power, ensure superior user experience and efficiency

Geneva, November 9, 2017 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is powering up wireless charging for mobile devices by introducing one of the world's first chips to support the latest industry standard for faster charging. Continue reading Advanced Wireless-Charging Chip from STMicroelectronics Enables Faster Charging of Smartphones and Tablets