Enphase Energy’s Enphase S280 Microinverter Complete Teardown Analysis

Dublin, April 17, 2017 (GLOBE NEWSWIRE) — Research and Markets has announced the addition of the "Enphase S280 Microinverter Flyer SPC Clean: Complete Teardown Analysis" report to their offering.
In a continuously expanding market, with a forecast compound annual growth rate of 5.9% through to 2021, Enphase Energy remains the world's leading solar microinverter company. It has shipped more than 11 million units to date, with 460,000 residential and commercial photovoltaic installations worldwide.
Designed for high-powered, 60-cell modules, the advanced grid-ready Enphase S280 Microinverter achieves the highest efficiency for module-level power electronics and reduces the cost per watt. With its all-AC approach, the S280 simplifies design and installation for 280VA installations, and delivers optimal energy harvest. The S280 is compatible with storage systems, including battery management systems.
This inverter is the result of Enphase's desire to enhance integration with a new generation of dedicated application specific integrated circuit (ASIC) in its topology. This approach reduces the size and number of components and improves reliability, safety and functionality.
Based on a complete teardown analysis of the Enphase S280, this report provides the system's complete bill of materials (BOM) and manufacturing cost. Physical and cost analysis of the microinverter ASIC is also included in the report.
A comparison with Enphase's previous microinverters is provided, highlighting the improvement made at the hardware level resulting in a shorter bill of material and significant cost reduction.
Key Topics Covered:
Overview / Introduction
Executive Summary
– Reverse Costing Methodology
Company Profile
– Enphase
– S280 Features
Physical Analysis
Views and Dimensions of the Inverter
– Inverter Opening
– Cable Support
– Connectors of the Inverter
– Electronic Board
– Top side – overview
– Top side – high definition photo
– Top side – P.C.B. markings
– Top side – main component markings
– Top side – main component identification
– Top side – discrete component markings
– Top side – discrete component identification
– Top side – magnetic component identification
– Top side – protection component identification
– Bottom side – high definition photo
– Bottom side – component identification
– Potting compound analysis
Cost Analysis
Investigating the BOM
– Estimation of the Cost of the PCB
– Estimation of the Cost of the Enphase MB8AC3100 ASIC
– BOM Cost – Electronic Board
– Estimation of the Cost of the Housing Parts
– BOM Housing
– Material Cost Breakdown
– Investigating the Added Value (AV) Cost
– Electronic Board Manufacturing Flow
– Details of the Electronic Board AV Cost
– Details of the System Assembly AV Cost
– Added Value Cost Breakdown
– Manufacturing Cost Breakdown
Estimated Price Analysis
– Estimation of the Manufacturing Price
– Estimation of the Selling Price
– Functional Cost Breakdown
For more information about this report visit http://www.researchandmarkets.com/research/hgqv57/enphase_s280 Continue reading Enphase Energy’s Enphase S280 Microinverter Complete Teardown Analysis

US Based Outdoor Vending Solutions Chooses OTI’s EMV Ready otiKiosk Readers and Telemetry Solution

ROSH PINNA, Israel, April 17, 2017 (GLOBE NEWSWIRE) — On Track Innovations Ltd. (OTI) (NASDAQ:OTIV), a global provider of near field communication (NFC), cashless payment and fuel management solutions, announces today that Outdoor Vending Solutions (OVS) is partnering with OTI and Apriva to provide secure EMV payments and telemetry for their bulk, unattended vending solutions.
Continue reading US Based Outdoor Vending Solutions Chooses OTI’s EMV Ready otiKiosk Readers and Telemetry Solution

Guests Sleep Green at Ramada Silicon Valley with Newly Installed Mitsubishi Electric Solar Panels

CYPRESS, Calif., April 17, 2017 (GLOBE NEWSWIRE) — Those visiting Silicon Valley can now book accommodations at the environmentally-friendly Ramada Silicon Valley located in Sunnyvale, Ca. The hotel recently announced the completion of a photovoltaic (PV) system by Sky Power Solar with solar modules from Mitsubishi Electric US, Inc. The 269 kW system includes 996 Mitsubishi Electric Diamond Premium solar modules and is projected to produce 426,000 kWh of power annually. The electricity generated by the system is expected to power at least 70 percent of the hotel’s 175 guest rooms, public lighting and three EV charging stations.
Continue reading Guests Sleep Green at Ramada Silicon Valley with Newly Installed Mitsubishi Electric Solar Panels

NEC TOKIN Completes Sale of EMD Business

GREENVILLE, S.C., April 14, 2017 (GLOBE NEWSWIRE) — KEMET Corporation (the “Company” or “KEMET”) (NYSE:KEM), a leading global supplier of passive electronic components, announced today that its joint venture, NEC TOKIN Corporation (“NEC TOKIN”), has completed its sale of its electro-mechanical devices ("EMD") business to NTJ Holdings 1 Ltd. ("NTJ"). The closing of the EMD sale fulfills a significant closing condition to KEMET’s purchase, through its wholly owned subsidiary, KEMET Electronics Corporation (“KEC”), of the outstanding shares of NEC TOKIN from NEC Corporation (“NEC”) pursuant to the previously disclosed Stock Purchase Agreement between NEC and KEC. The closing of KEC’s acquisition of NEC TOKIN is currently scheduled for on or about April 19, subject to the satisfactory completion of closing conditions.
Continue reading NEC TOKIN Completes Sale of EMD Business

Mercury Systems Receives $4M High Density Secure Memory Order for Military Avionics Application

ANDOVER, Mass., April 13, 2017 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ:MRCY) (www.mrcy.com) announced it received a $4M follow-on order from a leading defense prime contractor for high density secure memory devices deployed in an advanced military aircraft program. The order was booked in the Company’s fiscal 2017 third quarter and is expected to be shipped over the next several quarters. Continue reading Mercury Systems Receives $4M High Density Secure Memory Order for Military Avionics Application

Himax Announces Strategic Investment in Emza Visual Sense

TAINAN, Taiwan, April 13, 2017 (GLOBE NEWSWIRE) — Himax Technologies, Inc. (Nasdaq:HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced that it has made a strategic investment in cash in exchange for a 45.1% equity ownership of Emza Visual Sense Ltd. (“Emza”), with a one-year option to acquire the remaining 54.9% of Emza’s equity and all outstanding stock options. Purchase price to acquire the remaining equity and all outstanding stock options of Emza if Himax elects to exercise the one-year option includes an all-cash initial purchase amount, along with earnout payments contingent on the performance of Emza. Terms of the investment were not disclosed.
Continue reading Himax Announces Strategic Investment in Emza Visual Sense

Alliance Memory Launches New Line of 1Gb, 2Gb, and 4Gb Mobile LPDDR2 SDRAMs to Increase Battery Life in Portable Electronics

SAN CARLOS, CA–(Marketwired – Apr 12, 2017) – Alliance Memory today introduced a new line of high-speed CMOS mobile low-power DDR2 (LPDDR2) SDRAMs with densities of 1Gb, 2Gb, and 4Gb in the 134-ball FBGA package. The devices offer a variety of power-saving features, including 1.2 V/1.8 V operating voltages, to extend battery life in portable electronics, while their high density enables ultra-slim designs. Continue reading Alliance Memory Launches New Line of 1Gb, 2Gb, and 4Gb Mobile LPDDR2 SDRAMs to Increase Battery Life in Portable Electronics

Beyond Now: Retail Leaders to Share Insights on Today’s Retail Transformation at SPS Commerce In:fluence 2017

MINNEAPOLIS, April 12, 2017 (GLOBE NEWSWIRE) — SPS Commerce, Inc. (Nasdaq:SPSC), a leader in retail cloud services, announced that the industry’s leading retail innovators are bringing their expertise to the SPS Commerce In:fluence 2017 conference in Minneapolis, Minn., from May 1-3. Speakers will share real-world experiences and ideas on how to drive growth, sustain best practices, build collaborative trading relationships and continually embrace change for today’s competitive retail era and beyond.
Continue reading Beyond Now: Retail Leaders to Share Insights on Today’s Retail Transformation at SPS Commerce In:fluence 2017

Complete Teardown Analysis Autoliv’s 77GHz Multi Mode Radar SPC

Dublin, April 12, 2017 (GLOBE NEWSWIRE) — Research and Markets has announced the addition of the "Autoliv 77GHz Multi Mode Radar SPC: Complete Teardown Analysis" report to their offering.
Autoliv, one of the leading automotive radar system suppliers, has developed a new radar configuration. Instead of installing two radar systems, one for long range and another for medium range, the 77GHz Multi Mode Radar combines both. By expanding the detection area of the radar, Autoliv significantly reduces the cost of safety equipment.
The system integrates two electronic boards including Texas Instruments' microcontroller and automotive vision processor. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.
The radar uses Infineon's 77GHz SiGe monolithic microwave integrated circuit (MMIC) as its high-frequency transmitter and receiver. The RF dies are packaged in the latest version of eWLB, the fan-out wafer level package developed and manufactured by Infineon. The transmitter and receiver are connected to a dual power amplifier and to a waveform generator from Infineon.
Based on a complete teardown analysis of the Autoliv Multi Mode Radar, the report provides bill-of-material (BOM) and manufacturing cost of the radar sensor and a comparison with the Bosch MRR and Delphi RACam.
Key Topics Covered:
Overview / Introduction
Executive summary
– Company profile and main features
– Reverse costing methodology
Physical Analysis
Overview of the radar
– Views and dimensions of the radar
– Radar teardown
– Electronic boards
– MCU board
– Overview
– High definition photo
– Component markings and identification
– RF board
– Overview
– High definition photo
– Components markings and identification
– RF chipset analysis
– Comparison with Bosch MMR1 and Delphi RACam
Cost Analysis
RF board cross section and EDX analysis
– Estimation of the cost of the PCBs
– BOM cost – MCU board
– BOM cost – RF board
– BOM cost – housing
– Material cost breakdown
– Accessing the added value (AV) cost
– MCU board manufacturing flow
– RF board manufacturing flow
– Details of the housing assembly and functional test costs
– Added value cost breakdown
– Manufacturing cost Breakdown
Estimated Price Analysis
Estimation of the manufacturing price
For more information about this report visit http://www.researchandmarkets.com/research/5wd9pj/autoliv_77ghz Continue reading Complete Teardown Analysis Autoliv’s 77GHz Multi Mode Radar SPC